Red Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 20 Layer
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Red Solder Mask Prototype
Red Solder Mask Prototype High Density Interconnect HDI PCB High TG Material 20 Layer
Description
1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Specifications
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High precision prototype |
PCB bulk production |
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Max Layers |
1-28 layers |
1-14 layers |
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MIN Line width(mil) |
3mil |
4mil |
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MIN Line space(mil) |
3mil |
4mil |
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Min via (mechanical drilling) |
Board thickness≤1.2mm |
0.15mm |
0.2mm |
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Board thickness≤2.5mm |
0.2mm |
0.3mm |
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Board thickness2.5mm |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Aspect Ration |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Board thickness |
MAX |
8mm |
7mm |
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MIN |
2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm |
2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
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MAX Board size |
610*1200mm |
610*1200mm |
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Max copper thickness |
0.5-6oz |
0.5-6oz |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” |
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Hole copper thick |
25um 1mil |
25um 1mil |
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Tolerance |
Board thickness |
Board thickness≤1.0mm:+/-0.1mm |
Board thickness≤1.0mm:+/-0.1mm |
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Outline Tolerance |
≤100mm:+/-0.1mm |
≤100mm:+/-0.13mm |
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Impedance |
±10% |
±10% |
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LT CIRCUIT COMPANY [China (Mainland)]
Business Type:Manufacturer | |||
