FR4 HDI High Density Interconnect PCB
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
8 Layer FR4 H
8 Layer FR4 HDI High Density Interconnect PCB Immersion Gold 0.1mm Vias
Description
1. Professional manufacturer of PCB and PCB assembly specialized in single-sided PCB, double-sided PCB, multilayer PCB, PCB layout and design and PCB assembly
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Specifications
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High precision prototype |
PCB bulk production |
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Max Layers |
1-28 layers |
1-14 layers |
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MIN Line width(mil) |
3mil |
4mil |
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MIN Line space(mil) |
3mil |
4mil |
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Min via (mechanical drilling) |
Board thickness≤1.2mm |
0.15mm |
0.2mm |
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Board thickness≤2.5mm |
0.2mm |
0.3mm |
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Board thickness2.5mm |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Aspect Ration |
Aspect Ration≤13:1 |
Aspect Ration≤13:1 |
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Board thickness |
MAX |
8mm |
7mm |
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MIN |
2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm |
2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm |
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MAX Board size |
610*1200mm |
610*1200mm |
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Max copper thickness |
0.5-6oz |
0.5-6oz |
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Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” |
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Hole copper thick |
25um 1mil |
25um 1mil |
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Tolerance |
Board thickness |
Board thickness≤1.0mm:+/-0.1mm |
Board thickness≤1.0mm:+/-0.1mm |
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Outline Tolerance |
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